{"id":18471,"date":"2018-02-08T10:21:46","date_gmt":"2018-02-08T15:21:46","guid":{"rendered":"http:\/\/news.samsung.com\/us\/?p=18471"},"modified":"2019-06-18T19:03:10","modified_gmt":"2019-06-18T23:03:10","slug":"samsung-begins-mass-production-256gb-embedded-universal-flash-storage-automotive-applications","status":"publish","type":"post","link":"https:\/\/samsung-newsroom-production.barbariangroup.com\/us\/samsung-begins-mass-production-256gb-embedded-universal-flash-storage-automotive-applications\/","title":{"rendered":"Samsung Begins Mass Production of 256GB  Embedded Universal Flash Storage  for Automotive Applications"},"content":{"rendered":"<p><span class=\"press-release-open\"><strong>SEOUL, Korea \u2013 February 8, 2018<\/strong> \u2013<\/span> <strong>Samsung Electronics Co., Ltd.<\/strong>, the world leader in advanced memory technology, today announced that it has begun mass production of a <strong>256-gigabyte (GB) embedded Universal Flash Storage (eUFS) solution<\/strong> with advanced features based on automotive specifications from the JEDEC UFS 3.0 standard, for the first time in the industry.<\/p>\n<hr \/>\n<div id=\"attachment_18475\" style=\"width: 740px\" class=\"wp-caption aligncenter\"><a href=\"https:\/\/news.samsung.com\/us\/wp-content\/uploads\/2018\/02\/eUFS-_-E.jpg\"><img loading=\"lazy\" decoding=\"async\" aria-describedby=\"caption-attachment-18475\" class=\"wp-image-18475 size-large\" src=\"https:\/\/news.samsung.com\/us\/wp-content\/uploads\/2018\/02\/eUFS-_-E-950x672.jpg\" alt=\"Samsung's 256-gigabyte (GB) embedded Universal Flash Storage (eUFS) solution\" width=\"730\" height=\"516\" srcset=\"https:\/\/img.us.news.samsung.com\/us\/wp-content\/uploads\/2018\/02\/14133009\/eUFS-_-E-950x672.jpg 950w, https:\/\/img.us.news.samsung.com\/us\/wp-content\/uploads\/2018\/02\/14133009\/eUFS-_-E-600x424.jpg 600w, https:\/\/img.us.news.samsung.com\/us\/wp-content\/uploads\/2018\/02\/14133009\/eUFS-_-E.jpg 2000w\" sizes=\"auto, (max-width: 730px) 100vw, 730px\" \/><\/a><p id=\"caption-attachment-18475\" class=\"wp-caption-text\">Samsung&#8217;s 256-gigabyte (GB) embedded Universal Flash Storage (eUFS) solution<\/p><\/div>\n<hr \/>\n<p>Following the memory breakthrough of the automotive industry\u2019s first 128GB eUFS in September, 2017, Samsung\u2019s 256GB eUFS is now being shipped to automotive manufacturers preparing the market for Advanced Driver Assistance Systems (ADAS), next-generation infotainment systems and new-age dashboards in luxury vehicles.<\/p>\n<p>As thermal management is crucial for automotive memory applications, Samsung\u2019s 256GB eUFS extends the temperature range to between -40\u00b0C and 105\u00b0C for both operational and power-saving modes. Warranties for conventional embedded multimedia card (eMMC) 5.1 solutions generally cover -25\u00b0C to 85\u00b0C for vehicles in operation and -40\u00b0C to 85\u00b0C when in idle or power-saving mode.<\/p>\n<p>\u201cWith the new temperature threshold for automobile warranties, major automotive manufacturers can now design-in memory that\u2019s even well suited for extreme environments and know they will be getting highly reliable performance,\u201d <strong>said Kyoung Hwan Han, vice president of NAND marketing at Samsung Electronics.<\/strong> \u201cStarting with high-end vehicles, we expect to expand our business portfolio across the entire automotive market, while accelerating growth in the premium memory segment.\u201d<\/p>\n<p>Samsung\u2019s 256GB eUFS not only can easily endure the new temperature specification, despite the heat-sensitive nature of memory storage, but also through its temperature notification feature, a sensor will notify the host application processor (AP) when the device temperature exceeds 105\u00b0C or any pre-set level. The AP would then regulate its clock speed to lower the temperature to an acceptable level.<\/p>\n<p>Sequential reads for the 256GB eUFS can reach 850 megabytes per second (MB\/s), which is at the high end of the current JEDEC UFS 2.1 standard, and random read operations come in at 45,000 IOPS. In addition, a data refresh feature speeds up processing and enables greater system reliability by relocating older data to other less-used cells.<\/p>\n<p>The temperature notification, developed by Samsung, and data refresh features are included in UFS specification, version 3.0, which was announced last month by JEDEC, a global semiconductor standards organization.<\/p>\n<p>Samsung plans to bolster its technology partnerships with global automakers and component providers, and continue expanding its eUFS line-up with an aim to lead the premium memory market.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>SEOUL, Korea \u2013 February 8, 2018 \u2013 Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass production of a 256-gigabyte (GB) embedded Universal Flash Storage (eUFS) solution with advanced features based on automotive specifications from the JEDEC UFS 3.0 standard, for the first time in the [&hellip;]<\/p>\n","protected":false},"author":84,"featured_media":18475,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[29740,29718,17557,29739],"tags":[421,420,84],"blue-badge":[],"class_list":["post-18471","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-product-semiconductor-memory","category-product","category-semiconductor","category-product-semiconductor","tag-flash-memory","tag-memory-storage","tag-semiconductor"],"acf":{"turn_off_retargeting":false},"fimg_mobile_url":"https:\/\/img.us.news.samsung.com\/us\/wp-content\/uploads\/2018\/02\/14133009\/eUFS-_-E.jpg","fimg_url":"https:\/\/img.us.news.samsung.com\/us\/wp-content\/uploads\/2018\/02\/14133009\/eUFS-_-E.jpg","primary_category":{"term_id":29740,"name":"Memory","slug":"product-semiconductor-memory","term_group":0,"term_taxonomy_id":29740,"taxonomy":"category","description":"","parent":29739,"count":44,"filter":"raw","term_link":"https:\/\/samsung-newsroom-production.barbariangroup.com\/us\/category\/product\/product-semiconductor\/product-semiconductor-memory\/","term_path":"product\/product-semiconductor\/product-semiconductor-memory"},"badge":false,"_links":{"self":[{"href":"https:\/\/samsung-newsroom-production.barbariangroup.com\/us\/wp-json\/wp\/v2\/posts\/18471","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/samsung-newsroom-production.barbariangroup.com\/us\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/samsung-newsroom-production.barbariangroup.com\/us\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/samsung-newsroom-production.barbariangroup.com\/us\/wp-json\/wp\/v2\/users\/84"}],"replies":[{"embeddable":true,"href":"https:\/\/samsung-newsroom-production.barbariangroup.com\/us\/wp-json\/wp\/v2\/comments?post=18471"}],"version-history":[{"count":0,"href":"https:\/\/samsung-newsroom-production.barbariangroup.com\/us\/wp-json\/wp\/v2\/posts\/18471\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/samsung-newsroom-production.barbariangroup.com\/us\/wp-json\/wp\/v2\/media\/18475"}],"wp:attachment":[{"href":"https:\/\/samsung-newsroom-production.barbariangroup.com\/us\/wp-json\/wp\/v2\/media?parent=18471"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/samsung-newsroom-production.barbariangroup.com\/us\/wp-json\/wp\/v2\/categories?post=18471"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/samsung-newsroom-production.barbariangroup.com\/us\/wp-json\/wp\/v2\/tags?post=18471"},{"taxonomy":"blue-badge","embeddable":true,"href":"https:\/\/samsung-newsroom-production.barbariangroup.com\/us\/wp-json\/wp\/v2\/blue-badge?post=18471"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}